Location History:
- Ibaraki, JP (1985 - 1988)
- Osaka, JP (1991)
Company Filing History:
2 out of 172 
1 out of 3,869 
Years Active: 1985-1991
Title: Keigo Funakoshi - Innovator in Adhesive Tape Technology
Introduction
Keigo Funakoshi is an inventor based in Kameyama-shi, Japan. He has made significant contributions to the field of adhesive tape technology. His innovative approach focuses on improving the efficiency of tape cutting mechanisms used in semiconductor manufacturing.
Latest Patent Applications
Keigo Funakoshi's notable patent application is titled "ADHESIVE TAPE JOINING METHOD AND APPARATUS USING THE SAME." This application describes a tape cutting mechanism that cuts an adhesive tape joined to a semiconductor wafer along the contour of the wafer. The mechanism utilizes a rotary encoder to detect the rotating angle of each side roller, which guides a narrow region on both ends of the adhesive tape during the winding up and collection of unnecessary cutout tape. Additionally, a determination section is included to identify fractures in the narrow region of the unnecessary tape by comparing the actual rotating angle detected with a preset reference rotating angle.
Conclusion
Keigo Funakoshi's work in adhesive tape technology showcases his innovative spirit and dedication to enhancing manufacturing processes. His contributions, particularly in the area of tape cutting mechanisms, reflect the importance of precision in semiconductor production.