Nitto Electric Industrial Co., Ltd.

Nitto-denko Corporation

Keigo Funakoshi

Minoru Ametani

Takao Matsushita

Kenji Ohnishi

Akihiko Kira

Keizo Shirakura

Kozo Nomura

A process for peeling a protective film stuck to an upper-side of a wafer is disclosed. The protective film is peeled by adhering an adhesive tape to the upper side of the rear end of said protective film stuck on the wafer by means of a press roller, lifting the press roller and sliding said press roller forward, sliding a peeling unit forward to peel the adhesive tape together with the protective film by utilizing the adhesive force of the adhesive tape. The wafer is prevented from being damaged.

Process for peeling protective film off a wafer

A process for peeling a protective film off a thin article such as a silicon wafer is proposed. The film is peeled by sticking an adhesive tape to the protective film on the article and pulling it away from the article. The protective film is peeled only by the adhesive force of the adhesive tape.

Process for peeling protective film off a thin article

An apparatus for semiautomatically sticking an adhesive film on a silicon wafer and on a ring used as a carrier. After the ring and the silicon wafer have been manually positioned on tables, an adhesive film is automatically stuck on the ring and the silicon wafer. The excess portion of the film is then cut by hand along the ring and transversely. The apparatus greatly facilitates these works.

Apparatus for sticking adhesive film on a ring and a thin article

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Ibaraki, Japan

Keigo Funakoshi