The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 1991
Filed:
Nov. 28, 1988
Applicant:
Inventors:
Minoru Ametani, Osaka, JP;
Keigo Funakoshi, Osaka, JP;
Akihiko Kira, Osaka, JP;
Takao Matsushita, Osaka, JP;
Keizo Shirakura, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156241 ; 156249 ; 156344 ; 156584 ;
Abstract
A process for peeling a protective film stuck to an upper-side of a wafer is disclosed. The protective film is peeled by adhering an adhesive tape to the upper side of the rear end of said protective film stuck on the wafer by means of a press roller, lifting the press roller and sliding said press roller forward, sliding a peeling unit forward to peel the adhesive tape together with the protective film by utilizing the adhesive force of the adhesive tape. The wafer is prevented from being damaged.