This inventor holds 1 USPTO granted patent. Top assignee: The Hong Kong Polytechnic University. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Innovations of Kei Chun Cheng in Ultrasonic Technology
Introduction
Kei Chun Cheng is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of ultrasonic technology, particularly in the development of bonding tools for miniature components. His innovative approach has led to advancements that enhance the efficiency and effectiveness of ultrasonic transducers.
Latest Patents
One of Kei Chun Cheng's key patents is an ultrasonic transducer designed as a bonding tool. This tool applies pressure and ultrasonic energy simultaneously to join miniature components together. The invention features an ultrasonic driver that incorporates four composite wafers separated by electrodes. Unlike traditional bonding tools that utilize wafers made entirely of ceramic material, Cheng's design employs wafers with four sector parts of ceramic material separated by layers of polymer. This innovative configuration provides broader bandwidth operation and reduces spurious resonance modes, making it a significant advancement in the field.
Career Highlights
Cheng is affiliated with The Hong Kong Polytechnic University, where he continues to engage in research and development in ultrasonic technology. His work has not only contributed to academic knowledge but has also practical applications in various industries. His dedication to innovation is evident in his patent, which showcases his ability to solve complex engineering challenges.
Collaborations
Cheng has collaborated with esteemed colleagues such as Helen Lai Wa Chan and Siu Wing Or. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise, further enhancing the impact of their work in the field.
Conclusion
Kei Chun Cheng's contributions to ultrasonic technology exemplify the spirit of innovation. His patented ultrasonic transducer represents a significant leap forward in bonding techniques for miniature components. Through his work at The Hong Kong Polytechnic University and collaborations with fellow researchers, Cheng continues to push the boundaries of what is possible in his field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile