The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2001
Filed:
Apr. 23, 1999
Applicant:
Inventors:
Helen Lai Wa Chan, Kowloon, HK;
Siu Wing Or, Kowloon, HK;
Kei Chun Cheng, Kowloon, HK;
Chung Loong Choy, Kowloon, HK;
Assignee:
The Hong Kong Polytechnic University, Kowloon, HK;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/116 ; B23K 1/06 ; B06B 1/06 ; H01L 4/104 ;
U.S. Cl.
CPC ...
B32B 3/116 ; B23K 1/06 ; B06B 1/06 ; H01L 4/104 ;
Abstract
A bonding tool for applying pressure and ultrasonic energy simultaneously to join miniature components together includes an ultrasonic driver having four composite wafers separated by electrodes. Such bonding tools are known that use wafers made of wholly of ceramic material. By using wafers having four sector parts of ceramic material separated by layers of polymer as shown, bonding tools are provided with broader bandwidth operation and reduced spurious resonance modes.