This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2011.
Company Filing History:
Years Active: 2011
Title: Kee Leong Cheah: Innovator in Semiconductor Technology
Introduction
Kee Leong Cheah is a notable inventor based in Padang Serai, Malaysia. He has made significant contributions to the field of semiconductor technology. His innovative work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
Kee Leong Cheah holds a patent for "Semiconductor packages with stiffening support for power delivery." This invention relates to semiconductor packages designed to deliver electrical power to die-side components that are removably installed in sockets formed between a package stiffener and an electrical conductor. The package stiffener and the electrical conductor are electrically coupled to the power and ground terminals of the semiconductor package, improving the overall performance and reliability of the device. He has 1 patent to his name.
Career Highlights
Kee Leong Cheah is currently employed at Intel Corporation, a leading company in semiconductor manufacturing and technology. His role at Intel allows him to work on cutting-edge projects that push the boundaries of semiconductor innovation.
Collaborations
Kee Leong Cheah collaborates with talented professionals in his field, including his coworker Eu Soon Lee. Their combined expertise contributes to the advancement of semiconductor technologies.
Conclusion
Kee Leong Cheah is a prominent figure in the semiconductor industry, recognized for his innovative patent and contributions to technology at Intel Corporation. His work continues to influence the development of efficient semiconductor solutions.