Company Filing History:
Years Active: 2010-2013
Title: Kean Cheong Lee: Innovator in Electronic Component Technology
Introduction
Kean Cheong Lee is a prominent inventor based in Melaka, Malaysia. He has made significant contributions to the field of electronic components, holding a total of 4 patents. His innovative work focuses on improving the efficiency and functionality of electronic packaging.
Latest Patents
One of his latest patents is a leadframe strip and mold apparatus for an electronic component, along with a method of encapsulating an electronic component. This invention features a leadframe strip that comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. Notably, the central portion of the first support bars remains outside of the plastic housing of the two packages, enhancing the design's efficiency.
Career Highlights
Kean Cheong Lee is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in electronic component technology.
Collaborations
Throughout his career, Kean has collaborated with talented individuals such as Yang Hong Heng and Jeffrey Khai Huat Low. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Kean Cheong Lee's contributions to the field of electronic components demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and a drive to improve electronic packaging solutions.