The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Sep. 04, 2008
Alvin Wee Beng Tatt, Melaka, MY;
Fuaida Harun, Sha Alam, MY;
Soon Hock Tong, Melaka, MY;
Robert-christian Hagen, Sarching, DE;
Yang Hong Heng, Johor, MY;
Kean Cheong Lee, Melaka, MY;
Alvin Wee Beng Tatt, Melaka, MY;
Fuaida Harun, Sha Alam, MY;
Soon Hock Tong, Melaka, MY;
Robert-Christian Hagen, Sarching, DE;
Yang Hong Heng, Johor, MY;
Kean Cheong Lee, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.