Infineon Technologies Ag

Kean Cheong Lee

Yang Hong Heng

Jeffrey Khai Huat Low

Ralf Otremba

Xaver Schloegel

Juergen Schredl

Robert-Christian Hagen

Soon Hock Tong

Gerhard Deml

Alvin Wee Beng Tatt

Fuaida Harun

A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.

Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component

Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip.

Semiconductor module for a switched-mode power supply and method for its assembly

An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.

Lead frame with non-conductive connective bar

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Melaka, Malaysia

Kean Cheong Lee