Ke-Chien Li

Title: Ke-Chien Li: Innovator in Circuit Board Technology

Introduction

Ke-Chien Li is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of circuit board technology. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of circuit boards.

Latest Patents

Ke-Chien Li holds a patent for a circuit board and its manufacturing method. This invention includes a substrate, a build-up circuit structure, a graphene oxide layer, a graphene layer, and an insulating material layer. The build-up circuit structure is strategically placed on the substrate and consists of at least one inner circuit, multiple dielectric layers, an outer circuit, and several conductive vias. The dielectric layer is positioned on the inner circuit, while the outer circuit is located on the dielectric layer. The conductive vias penetrate the dielectric layer, establishing an electrical connection between the inner and outer circuits. The graphene oxide layer and the graphene layer are arranged at intervals on the build-up circuit structure, corresponding to the dielectric layer and the outer circuit. Finally, the insulating material layer is placed on the graphene layers, featuring an opening that exposes the graphene layer.

Career Highlights

Ke-Chien Li is associated with Unimicron Technology Corporation, where he continues to innovate in circuit board technology. His work has been instrumental in advancing the capabilities of electronic components.

Collaborations

He collaborates with talented coworkers, including Chun-Hung Kuo and Chih-Chun Liang, who contribute to the innovative environment at Unimicron Technology Corporation.

Conclusion

Ke-Chien Li's contributions to circuit board technology exemplify the spirit of innovation. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving electronic components.