Ichiharashi, Japan

Kazutsune Kikuta


Average Co-Inventor Count = 4.1

ph-index = 11

Forward Citations = 231(Granted Patents)


Location History:

  • Yokohamashi, JP (1990)
  • Yokohama, JP (1993)
  • Ichiharashi, JP (1981 - 1994)
  • Ichihara, JP (1991 - 1994)
  • Chiba, JP (1994)

Company Filing History:


Years Active: 1981-1994

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21 patents (USPTO):Explore Patents

Title: The Innovative Patents of Kazutsune Kikuta

Introduction: Kazutsune Kikuta, based in Ichiharashi, Japan, is an accomplished inventor with a remarkable portfolio of 21 patents. His work primarily focuses on the development of advanced materials, particularly in the realm of polyimide films.

Latest Patents: Among his latest innovations is the adhesive polyimide film, which is a silicon-modified material consisting mainly of specific repeating units. This film showcases impressive adhesive properties and heat resistance, functioning well at relatively low curing temperatures ranging from 130°C to 230°C. Another significant patent includes metal-clad laminates and the methods behind their production, demonstrating his commitment to creating high-quality industrial materials.

Career Highlights: Kikuta's career is marked by his contributions to Chisso Corporation, where he has continued to push the boundaries of material science. His extensive research and development efforts have not only earned him numerous patents but have also impacted the fields of electronics and aerospace.

Collaborations: Throughout his career, Kazutsune Kikuta has collaborated with talented coworkers like Akihiro Sato and Shiro Konotsune, contributing to the success of various projects and the advancement of their collective expertise in polymer science.

Conclusion: Kazutsune Kikuta stands out as a prominent figure in the field of material innovation. His inventive spirit and dedication to advancing polyimide technology reflect his passion for creating efficient and effective solutions in the industry. As he continues to innovate, his work remains influential in shaping the future of material applications.

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