The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 1994

Filed:

Sep. 15, 1992
Applicant:
Inventors:

Kouichi Kunimune, Ichiharashi, JP;

Yoshihiro Soeda, Yokohamashi, JP;

Setsuo Itami, Ichiharashi, JP;

Kazutsune Kikuta, Ichiharashi, JP;

Assignee:

Chisso Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ;
U.S. Cl.
CPC ...
528353 ; 528 26 ; 528 28 ; 528 33 ; 528 38 ; 528125 ; 528128 ; 528170 ; 528172 ; 528173 ; 528176 ; 528183 ; 528185 ; 528188 ; 528220 ; 528224 ; 528229 ; 528350 ; 528351 ; 428446 ; 428447 ; 428450 ; 4284735 ; 4284752 ;
Abstract

A silicon-modified, adhesive polyimide film composed mainly of the repetition units of the formula (I) and a process for producing a polyimide film composite product using the above film are provided, the formula (I) being ##STR1## the above process for producing a polyimide film composite product comprising subjecting the above-silicon-modified polyimide film to contact-bonding on heating to a material to be adhered, at an ultimate curing temperature of 130.degree.-230.degree. C. The above polyimide film is highly adhesive and heat-resistant in spite of heating at a relatively low temperature.


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