The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 1993
Filed:
Nov. 04, 1991
Applicant:
Inventors:
Shiro Konotsune, Yokosuka, JP;
Kazutsune Kikuta, Yokohama, JP;
Masaya Uetsuki, Yokohama, JP;
Hiroaki Hase, Kawasaki, JP;
Assignee:
Chisso Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; C08G / ;
U.S. Cl.
CPC ...
428458 ; 4284735 ; 428901 ; 528 26 ;
Abstract
A flexible copper-applied substrate comprises a copper foil and a resin layer comprising a composite material of a polyimide and a polyimide silicone, the resin layer being directly formed on the surface of the copper foil, said substrate being producible by applying a polyamide acid composite composed of a mixed solution of a polyamide acid and a polyamide acid alkylsilane to a copper foil and heating.
Konotsune, Shiro. (1993). Flexible copper-applied substrates (U.S. Patent No. 5192619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5192619
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile