Sakai, Japan

Kazuo Kondo

This inventor holds 2 USPTO granted patents. Top assignees: Nitto Boseki Co., Ltd., Osaka Prefecture University. Active years: 2012-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuo Kondo. Retrieved from https://idiyas.com/inventor/kazuo-kondo-sf5qqu6b

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Osaka, JP (2012)
  • Sakai, JP (2016)

Company Filing History:


Years Active: 2012-2016

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2 patents (USPTO):Explore Patents

Title: Kazuo Kondo: Innovator in Copper Filling Techniques

Introduction

Kazuo Kondo, an accomplished inventor based in Sakai, Japan, has made significant contributions to the field of copper plating methods. With a total of two patents to his name, Kondo has developed innovative techniques that address the challenges of filling non-through holes in substrates with copper efficiently.

Latest Patents

Kondo's most notable patents include a groundbreaking Copper Filling-Up Method. This method is designed to effectively fill copper in conductivity-rendered non-through holes on substrates, particularly those with an aspect ratio of 5 or more. The process utilizes an acidic copper plating bath, which consists of a water-soluble copper salt, sulfuric acid, chlorine ions, a brightener, and a copolymer of diallylamines and sulfur dioxide. This method enables the filling of copper in a short period of time through a technique called periodic current reversal copper plating.

Additionally, Kondo has developed another Copper Filling-Up Method focusing on filling copper in non-through holes that have undergone conductivity treatment. This patent emphasizes utilizing an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid, and a filling additive that acts as both a brightener and a leveler, thereby optimizing the plating process.

Career Highlights

Throughout his career, Kondo has worked with several reputable organizations, including Osaka Prefecture University Public Corporation and Nitto Boseki Co., Ltd. These experiences have allowed him to refine his skills and contribute valuable research to the field of semiconductor manufacturing.

Collaborations

Kondo has collaborated with notable colleagues such as Naoki Okamoto and Masaru Bunya. These collaborations have fostered an enriching research environment, leading to the development of innovative solutions in copper filling technologies.

Conclusion

Kazuo Kondo's contributions to copper plating methods stand as a testament to his inventive spirit and dedication to advancing technology. His patents reflect a deep understanding of material science and innovation, paving the way for more efficient manufacturing processes in the electronics industry. As he continues to develop and refine his methods, Kondo remains a pivotal figure in the realm of patents and inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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