The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Aug. 23, 2013
Osaka Prefecture University Public Corporation, Sakai-shi, Osaka, JP;
Nitto Boseki Co., Ltd., Fukushima, JP;
Kazuo Kondo, Sakai, JP;
Takeyasu Saito, Sakai, JP;
Naoki Okamoto, Sakai, JP;
Masaru Bunya, Koriyama, JP;
Minoru Takeuchi, Tokyo, JP;
OSAKA PREFECTURE UNIVERSITY PUBLIC CORPORATION, Sakai, JP;
NITTO BOSEKI CO., LTD., Fukushima, JP;
Abstract
There is provided a method of well filling copper in a conductivity-rendered non-through hole having an aspect ratio (depth/hole diameter) of 5 or more on a substrate in a short period of time, and the method comprises using an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid, chlorine ion, a brightener and a copolymer of diallylamines and sulfur dioxide and filling copper in the non-through hole by periodic current reversal copper plating.