The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Apr. 02, 2010
Applicants:
Naoki Okamoto, Osaka, JP;
Kazuo Kondo, Osaka, JP;
Hideyuki Kuri, Osaka, JP;
Masaru Bunya, Fukushima, JP;
Minoru Takeuchi, Tokyo, JP;
Inventors:
Naoki Okamoto, Osaka, JP;
Kazuo Kondo, Osaka, JP;
Hideyuki Kuri, Osaka, JP;
Masaru Bunya, Fukushima, JP;
Minoru Takeuchi, Tokyo, JP;
Assignees:
Osaka Prefecture University Public Corporation, Osaka, JP;
Nitto Boseki Co., Ltd., Fukushima, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of filling copper in a non-through hole on a substrate that has been treated to render it conductive, which comprises plating said substrate in an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid and a filling additive that is a polymer having the activities of both of a brightener and a leveler.