This inventor holds 1 USPTO granted patent. Top assignees: Nitto Boseki Co., Ltd., Osaka Prefecture University. Active years: 2012.
Company Filing History:
1 out of 266 
1 out of 89 Years Active: 2012
Title: Innovations of Hideyuki Kuri
Introduction
Hideyuki Kuri is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in the area of copper plating technology. His innovative approach has led to the development of a unique method that enhances the efficiency of filling non-through holes on conductive substrates.
Latest Patents
Kuri holds 1 patent for his invention titled "Copper filling-up method." This method involves filling copper in a non-through hole on a substrate that has been treated to render it conductive. The process utilizes an acidic copper plating bath that contains a water-soluble copper salt, sulfuric acid, and a polymer filling additive that acts as both a brightener and a leveler.
Career Highlights
Throughout his career, Hideyuki Kuri has worked with esteemed institutions such as Osaka Prefecture University and Nitto Boseki Co., Ltd. His work has been instrumental in advancing the understanding and application of copper plating techniques in various industries.
Collaborations
Kuri has collaborated with notable colleagues, including Minoru Takeuchi and Kazuo Kondo. Their combined expertise has contributed to the successful development and implementation of innovative technologies in their respective fields.
Conclusion
Hideyuki Kuri's contributions to the field of copper plating technology exemplify the impact of innovative thinking in materials science. His patented method showcases the potential for advancements that can enhance manufacturing processes and improve product quality.