Company Filing History:
Years Active: 2006-2008
Title: Kazumichi Shimizu: Innovator in Electronic Parts Packaging
Introduction
Kazumichi Shimizu is a notable inventor based in Toyonaka, Japan. He has made significant contributions to the field of electronic parts packaging, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
Shimizu's latest patents include an electronic parts packaging method and a method for mounting a semiconductor element to an interposer by compression bonding. The electronic parts packaging method involves bonding an electronic component and a circuit formation article using a bonding material that contains resin. This process ensures that the bumps of the electronic-component bonding region and the electrodes of the circuit formation article are in mutual electrical contact. The electronic component and the circuit formation article are thermocompression-bonded together upon curing of the bonding material. Additionally, a bonding-material flow regulating member is utilized to control the flow of the bonding material during the bonding process. The second patent focuses on a semiconductor element mounting method that enhances productivity. This method includes forming bumps on electrodes of a wafer, temporarily bonding the wafer and an interposer via an insulative resin, and curing the resin through heating and pressurization. This results in a final compression bond between the wafer and the interposer, allowing for efficient production of individual semiconductor elements.
Career Highlights
Kazumichi Shimizu is associated with Matsushita Electric Industrial Co., Ltd., where he has been able to apply his innovative ideas in a practical setting. His work has contributed to advancements in electronic component technology, making significant impacts in the industry.
Collaborations
Shimizu has collaborated with notable coworkers, including Hidenobu Nishikawa and Kazuto Nishida. Their combined efforts have furthered the development of innovative solutions in electronic parts packaging.
Conclusion
Kazumichi Shimizu stands out as a prominent inventor in the field of electronic parts packaging. His patents reflect a commitment to innovation and efficiency in technology. His contributions continue to influence the industry and pave the way for future advancements.