The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Jun. 14, 2001
Hidenobu Nishikawa, Ikoma, JP;
Kazuto Nishida, Katano, JP;
Kazumichi Shimizu, Toyonaka, JP;
Shuji Ono, Kobe, JP;
Hiroyuki Otani, Ikoma, JP;
Hidenobu Nishikawa, Ikoma, JP;
Kazuto Nishida, Katano, JP;
Kazumichi Shimizu, Toyonaka, JP;
Shuji Ono, Kobe, JP;
Hiroyuki Otani, Ikoma, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electronic component and the circuit formation article are thermocompression-bonded to each other upon curing of the bonding material. A bonding-material flow regulating member of the electronic-component bonding region regulates flow of the bonding material toward a peripheral portion of the electronic-component bonding region during bonding of the circuit formation article to the electronic component.