The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Sep. 25, 2002
Hidenobu Nishikawa, Ikoma, JP;
Kazuto Nishida, Katano, JP;
Kazumichi Shimizu, Toyonaka, JP;
Hiroyuki Otani, Ikoma, JP;
Hidenobu Nishikawa, Ikoma, JP;
Kazuto Nishida, Katano, JP;
Kazumichi Shimizu, Toyonaka, JP;
Hiroyuki Otani, Ikoma, JP;
Matsushita Electric Industrial Co., Ltd., Osaka-fu, JP;
Abstract
A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, curing the resin by performing heating and pressurization so that the wafer and the interposer are finally compression-bonded, wherein the electrodes of the wafer and electrodes of the interposer are bonded to each other, respectively, and wherein insulative resin overflowing from between the wafer and the interposer flows into grooves disposed so as to be coincident with dicing lines of the wafer, thus providing a uniform flow of the insulative resin, and thereafter, cutting and separating this bonded unit into individual semiconductor elements.