Ibaraki, Japan

Kazuhiro Moriwaki

This inventor holds 1 USPTO granted patent. Top assignee: Jx Advanced Metals Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuhiro Moriwaki. Retrieved from https://idiyas.com/inventor/kazuhiro-moriwaki-o1wmtasv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kazuhiro Moriwaki: Innovator in Copper Powder Technology

Introduction

Kazuhiro Moriwaki is a notable inventor based in Ibaraki, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper powder technology. His innovative approach has led to advancements that are valuable in various industrial applications.

Latest Patents

Moriwaki holds a patent for a unique method of manufacturing copper powder. The patent, titled "Copper powder, and method for manufacturing copper powder," describes a copper powder containing copper particulates. This copper powder has a specific characteristic, wherein the number of particles with a size of 1.5 μm or more is limited to 10,000 or less per 10 ml of a solution. This measurement is taken using an in-liquid particle counter, with the solution having a copper ion concentration of 10 g/L, achieved by dissolving the copper particulates in nitric acid.

Career Highlights

Kazuhiro Moriwaki is associated with JX Advanced Metals Corporation, where he applies his expertise in materials science. His work at the company focuses on enhancing the quality and application of copper materials in various industries. His innovative contributions have positioned him as a key figure in the advancement of copper powder technology.

Conclusion

Kazuhiro Moriwaki's work in developing copper powder and its manufacturing method showcases his commitment to innovation in materials science. His contributions are significant in enhancing industrial applications of copper materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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