Kaysar M Rahim

Title: Kaysar M Rahim: Innovator in Wafer Level Packaging

Introduction

Kaysar M Rahim is an accomplished inventor based in Irving, TX (US). He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent related to wafer level packages. His work is instrumental in enhancing the reliability and performance of electronic devices.

Latest Patents

Kaysar M Rahim holds a patent titled "Solder Fatigue Arrest for Wafer Level Package." This patent describes a wafer level package that includes a wafer, a lead for connecting the wafer to an electrical circuit, and a core disposed of the lead. The lead is often a copper pillar, and the core can be plated onto the copper pillar or polymer screen-plated onto the lead. The core extends between approximately thirty-five micrometers (35 µm) and fifty micrometers (50 µm) from the lead, covering a significant portion of the lead's surface area. The design of the core can vary, including stud-shaped extensions and different orientations relative to the lead.

Career Highlights

Kaysar M Rahim is currently employed at Maxim Integrated Products, Inc., where he continues to innovate in the field of semiconductor technology. His expertise in wafer level packaging has positioned him as a valuable asset to his company and the industry at large.

Collaborations

Kaysar has collaborated with notable colleagues such as Yong L Xu and Tiao Zhou. Their combined efforts contribute to advancements in semiconductor packaging and related technologies.

Conclusion

Kaysar M Rahim's contributions to wafer level packaging through his innovative patent demonstrate his commitment to enhancing electronic device reliability. His work at Maxim Integrated Products, Inc. and collaborations with esteemed colleagues further solidify his reputation as a leading inventor in the field.