Maxim Integrated Products, Inc.

Kaysar M Rahim

Arkadii V Samoilov

Viren V Khandekar

Yi-Sheng Anthony Sun

Tiao Zhou

Yong L Xu

Xiansong Chen

A wafer level package includes a wafer, a lead disposed of the wafer for connecting the wafer to an electrical circuit, and a core disposed of the lead. In some embodiments, the lead disposed of the wafer is a copper pillar, and the core is plated onto the copper pillar. In some embodiments, the core is polymer screen-plated onto the lead. In some embodiments, the core extends between at least approximately thirty-five micrometers (35 &#x3bc;m) and fifty micrometers (50 &#x3bc;m) from the lead. In some embodiments, the core covers between at least approximately one-third (&#x2153;) and one-half (&#xbd;) of the surface area of the lead. In some embodiments, the core comprises a stud-shape extending from the lead. In some embodiments, the core extends perpendicularly across the lead. In some embodiments, the core extends longitudinally along the lead. Further, a portion of the core can extend perpendicularly from a longitudinal core.

Growing community of inventors

Irving, TX, United States of America

Kaysar M Rahim