Kay Krupka

Title: Kay Krupka - Innovator in Micro-Relay Technology

Introduction

Kay Krupka is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of micro-relay technology, showcasing his innovative spirit through his patented inventions. His work exemplifies the intersection of engineering and creativity, leading to advancements in electronic components.

Latest Patents

Krupka holds a patent for a microstructure relay. This invention features a body that includes upper and lower portions, with the lower portion formed from a substrate. The upper portion is designed to avoid bonding with the lower portion, enhancing functionality. A support member is fixed to the body, creating a cantilever that allows for precise movement. The design includes a cavity formed between the upper surface of the support member and the lower surface of the upper portion. A first contact region on the upper surface enables electrical coupling when the support member pivots toward the lower surface.

Career Highlights

Throughout his career, Kay Krupka has focused on developing innovative solutions in the field of microelectronics. His dedication to research and development has led to the successful patenting of his micro-relay technology. This achievement highlights his expertise and commitment to advancing electronic components.

Collaborations

Krupka has worked alongside talented colleagues, including Dirk Wagenaar and Helmut F Schlaak. Their collaborative efforts have contributed to the success of various projects and innovations in the field.

Conclusion

Kay Krupka's contributions to micro-relay technology demonstrate his innovative capabilities and commitment to advancing the field of electronics. His patented inventions continue to influence the industry and inspire future developments.