Other

Kay Krupka

Uppili Sridhar

Helmut F Schlaak

Pang Dow Foo

Victor Samper

Dirk Wagenaar

A microstructure relay is provided, having a body that includes upper and lower portions. The lower portion is formed from a substrate, and the upper portion is formed on the substrate to avoid bonding of the lower portion to the upper portion. A support member is fixed to the body at a first end of the support member to form a cantilever, wherein an upper surface of the support member and a lower surface of the upper portion of the body form a cavity. A first contact region is located on the upper surface at a second end of the support member. The first contact region comprises a first contact, wherein pivoting the support member toward the lower surface causes the first contact to be electrically coupled to a counter contact.

Growing community of inventors

Berlin, Germany

Kay Krupka