Kyoto, Japan

Katsuyuki Inoue



Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • Kizugawa, JP (2012)
  • Kyoto, JP (2015)

Company Filing History:


Years Active: 2012-2015

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3 patents (USPTO):Explore Patents

Title: Innovations of Katsuyuki Inoue in Wafer Bonding Technology.

Introduction

Katsuyuki Inoue is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of wafer bonding technology, holding a total of 3 patents. His work focuses on methods that enhance the efficiency and effectiveness of wafer bonding processes.

Latest Patents

Inoue's latest patents include a method for bonding wafers and a wafer level package design. The method for bonding wafers involves forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer made of a material with low wettability to AuSn. This is followed by creating a bonding layer on the diffusion preventing layer, ensuring that the bonding layer remains behind the edge of the diffusion preventing layer. A second bonding part is then formed on a second wafer, allowing for eutectic bonding between the two wafers using AuSn solder.

Another notable patent is the design of a wafer level package, which features a first wafer with multiple chips mounted in a plane, opposed by a second wafer. The two wafers are joined with a seal frame that encases the periphery of each chip, creating a gap between adjacent seal frames. This design includes a partial connect part that connects the seal frames of adjacent chips, enhancing the overall structure and functionality of the package.

Career Highlights

Katsuyuki Inoue is currently employed at Omron Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the capabilities of wafer bonding and packaging, making significant impacts in the industry.

Collaborations

Inoue collaborates with notable colleagues such as Toshiaki Okuno and Takeshi Fujiwara. Their combined expertise contributes to the development of cutting-edge technologies in wafer bonding.

Conclusion

Katsuyuki Inoue's contributions to wafer bonding technology exemplify his innovative spirit and dedication to advancing the field. His patents reflect a deep understanding of the complexities involved in semiconductor manufacturing, positioning him as a key figure in this area of research.

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