The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Mar. 16, 2011
Toshiaki Okuno, Shiga, JP;
Katsuyuki Inoue, Kyoto, JP;
Takeshi Fujiwara, Shiga, JP;
Tomonori Seki, Shiga, JP;
Toshiaki Okuno, Shiga, JP;
Katsuyuki Inoue, Kyoto, JP;
Takeshi Fujiwara, Shiga, JP;
Tomonori Seki, Shiga, JP;
OMRON Corporation, Kyoto, JP;
Abstract
A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other.