Tokyo, Japan

Katsunori Haruna

This inventor holds 2 USPTO granted patents. Top assignee: Threebond Co., Ltd.. Active years: 1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Katsunori Haruna. Retrieved from https://idiyas.com/inventor/katsunori-haruna

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 1991

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2 patents (USPTO):Explore Patents

Title: Innovations of Katsunori Haruna

Introduction

Katsunori Haruna is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesive compositions, holding a total of 2 patents. His work focuses on developing innovative materials that enhance the performance and durability of adhesives.

Latest Patents

Haruna's latest patents include an anaerobic composition and an anaerobically curing adhesive sealing composition. The anaerobic composition comprises a polymerizable monomer with at least one ethylenic double bond, a free radical initiator, and at least one azole compound. The anaerobically curing adhesive sealing composition features a mono(meth)acrylate monomer and a (meth)acrylate prepolymer with a urethane structure, which provides excellent elasticity and resistance to oil and heat.

Career Highlights

Katsunori Haruna is associated with Threebond Co., Ltd., where he continues to innovate in adhesive technologies. His work has been instrumental in advancing the capabilities of sealing compositions used in various applications.

Collaborations

Haruna collaborates with talented coworkers, including Shuji Mochizuki and Atsushi Okuma, to further enhance the development of adhesive solutions.

Conclusion

Katsunori Haruna's contributions to adhesive technology through his patents reflect his commitment to innovation in the field. His work continues to influence the industry and improve the performance of adhesive materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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