Katsuji Inagaki

Title: Katsuji Inagaki: Innovator in Semiconductor Bonding Technology

Introduction

Katsuji Inagaki is a notable inventor based in Hiratsuka, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patents. With a total of two patents to his name, Inagaki has focused on developing advanced materials for bonding semiconductor elements.

Latest Patents

Inagaki's latest patents include a noble metal paste designed for the bonding of semiconductor elements. This precious metal paste is engineered to prevent contamination of the bonded member, ensuring a uniform coating and maintaining optimal conditions post-bonding. The paste consists of a precious metal powder with a purity of 99.9 mass % or more and an average particle diameter ranging from 0.1 to 0.5 micrometers. Additionally, the organic solvent used in the paste has a boiling point between 200 to 350 degrees Celsius, and it exhibits a thixotropy index (TI) value of 6.0 or more, as measured by a rotational viscometer.

Career Highlights

Throughout his career, Katsuji Inagaki has worked with Tanaka Kikinzoku Kogyo Co., Ltd., a prominent company in the field of precious metals and semiconductor materials. His work has been instrumental in advancing the technology used in semiconductor bonding processes.

Collaborations

Inagaki has collaborated with notable coworkers such as Masayuki Miyairi and Nobuyuki Akiyama, contributing to the development of innovative solutions in semiconductor technology.

Conclusion

Katsuji Inagaki's contributions to the field of semiconductor bonding technology through his patents highlight his role as an influential inventor. His work continues to impact the industry positively, showcasing the importance of innovation in technology.