This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Infineon Technologies Ag. Active years: 2016.
Company Filing History:
Years Active: 2016
Title: Katharina Maier: Innovator in Thinned Wafer Technologies
Introduction
Katharina Maier is an innovative inventor based in Villach, Austria. With a keen focus on technology and materials science, she has developed a notable patent that contributes to the semiconductor industry. Her work is crucial in advancing wafer technology and improving device performance.
Latest Patents
Katharina holds a single patent titled "Devices with Thinned Wafer." This invention describes various methods, apparatuses, and devices where a main wafer is irreversibly bonded to a carrier wafer. The main wafer is then thinned to a thickness of 300 micrometers or below. This advancement aids in reducing the thickness of wafers, enhancing their utility in various electronic applications.
Career Highlights
Katharina is associated with Infineon Technologies AG, a leading company in semiconductor solutions. Her contributions to the field exemplify her commitment to innovation and excellence. The patent reflects her technical expertise and significant role in the advancement of thin wafer technologies, paving the way for more efficient electronic devices.
Collaborations
Throughout her career, Katharina has collaborated with esteemed colleagues, including Andre Brockmeier and Christian Griessler. Working together in a dynamic team environment has facilitated their collective contributions to semiconductor technologies and further innovations.
Conclusion
Katharina Maier's inventive spirit and technical capabilities have made her a valuable asset in the field of semiconductor innovations. With her patent on thinned wafer technology, she continues to influence the industry positively. Her work not only showcases individual brilliance but also highlights the significance of collaboration in fostering advancements in technology.