The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Mar. 03, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Andre Brockmeier, Villach, AT;
Christian Griessler, Villach, AT;
Katharina Maier, Villach, AT;
Peter Zorn, Villach, AT;
Kai-Alexander Schreiber, Villach, AT;
Francesco Solazzi, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B32B 37/00 (2006.01); B32B 38/08 (2006.01); B32B 38/10 (2006.01); B81B 7/00 (2006.01); B81C 99/00 (2010.01);
U.S. Cl.
CPC ...
B81C 1/00357 (2013.01); B32B 37/0046 (2013.01); B32B 38/08 (2013.01); B32B 38/10 (2013.01); B81B 7/008 (2013.01); B81C 1/0015 (2013.01); B81C 1/00238 (2013.01); B81C 99/0005 (2013.01); B32B 2457/14 (2013.01); B81C 2001/00452 (2013.01); B81C 2201/014 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0735 (2013.01); Y10T 156/15 (2015.01);
Abstract
Methods, apparatuses and devices are described where a main wafer is irreversibly bonded to a carrier wafer and thinned to reduce a thickness of the main wafer, for example down to a thickness of 300 μm or below.