Burghausen, Germany

Karlheinz Langsdorf


Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 42(Granted Patents)


Location History:

  • The Makena, SG (2003)
  • Burghausen, DE (1989 - 2010)

Company Filing History:


Years Active: 1989-2010

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4 patents (USPTO):Explore Patents

Title: Karlheinz Langsdorf: Innovator in Semiconductor Technology

Introduction

Karlheinz Langsdorf is a notable inventor based in Burghausen, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on improving the processes involved in semiconductor wafer production.

Latest Patents

Langsdorf's latest patents include a method for producing polished semiconductor wafers. This method involves cutting semiconductor wafers from a crystal and subjecting them to a series of processing steps that remove material from both the front and rear sides. Another significant patent is a process for the wet-chemical surface treatment of semiconductor wafers. This process follows mechanical surface treatment and includes a sequence of treatment steps such as wet-chemical surface cleaning, acid etching, and a final drying step to render the surface hydrophilic.

Career Highlights

Throughout his career, Langsdorf has worked with prominent companies in the semiconductor industry. He has been associated with Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH and Wacker Siltronic Gesellschaft für Halbleiter Materialien AG. His experience in these organizations has contributed to his expertise in semiconductor technologies.

Collaborations

Langsdorf has collaborated with notable colleagues, including Maximilian Stadler and Gerhard Brehm. Their joint efforts have further advanced the field of semiconductor technology.

Conclusion

Karlheinz Langsdorf's innovative work in semiconductor technology has led to significant advancements in the production and treatment of semiconductor wafers. His contributions continue to impact the industry positively.

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