This inventor holds 1 USPTO granted patent. Top assignee: Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh. Active years: 1977.
Company Filing History:
Years Active: 1977
Title: The Innovative Contributions of Karl Pritscher
Introduction
Karl Pritscher is a notable inventor based in Burghausen, Germany. He has made significant contributions to the field of electronics, particularly in the packaging of semiconductor discs. His innovative approach has led to the development of a unique solution that enhances the efficiency and safety of semiconductor packaging.
Latest Patents
Karl Pritscher holds a patent for the "Packaging of Semiconductor Discs." This invention features a stackable plastics pallet designed for packaging semiconductor discs on a gas-tight foil covering. The pallet includes a series of circular depressions, each specifically designed to accommodate a semiconductor disc. Additionally, the pallet incorporates means for securing the discs between the pallets, utilizing sloping part-sector shaped surfaces that clamp the semiconductor discs at their outermost rims, thereby immobilizing them effectively. This innovative design ensures the safe transport and storage of delicate semiconductor components.
Career Highlights
Karl Pritscher is associated with Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, a company known for its advancements in electronic materials. His work at this organization has allowed him to focus on developing solutions that address the challenges faced in the semiconductor industry. His patent reflects his commitment to innovation and excellence in his field.
Collaborations
Throughout his career, Karl has collaborated with esteemed colleagues such as Helmut Kirschner and Gunther Lechner. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Karl Pritscher's contributions to the field of semiconductor packaging exemplify the spirit of innovation. His patent for the packaging of semiconductor discs showcases his ability to solve complex problems with practical solutions. His work continues to influence the electronics industry, paving the way for future advancements.