Karl Heinz Probst

Title: Karl Heinz Probst: Innovator in Multi-Step Structures

Introduction

Karl Heinz Probst is a notable inventor based in Kornwestheim, Germany. He has made significant contributions to the field of substrate technology, particularly in the production of multi-step structures. With a total of 2 patents, Probst's work has garnered attention in the industry.

Latest Patents

Probst's latest patents focus on a method for producing a multi-step structure in a substrate. This innovative technique involves creating a structure of openings in two or more layers of silylated, polyimide photoresist. The openings in subsequent layers, which overlap previous openings, are designed to be of larger size. The structure is then transferred to an organic substrate using oxygen plasma etching with up to 3% CF.sub.4. Notably, the smallest opening transferred to the substrate extends through the substrate, showcasing the precision of his method.

Career Highlights

Karl Heinz Probst is currently associated with International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop advanced technologies that push the boundaries of substrate applications.

Collaborations

Throughout his career, Probst has collaborated with esteemed colleagues such as Johann W Bartha and Johann Greschner. These partnerships have contributed to the advancement of his innovative projects and have fostered a collaborative environment for technological development.

Conclusion

In summary, Karl Heinz Probst is a distinguished inventor whose work in multi-step structures has made a significant impact in the field. His patents and collaborations reflect his commitment to innovation and excellence in technology.