This inventor holds 4 USPTO granted patents. Top assignee: Kabushiki Kaisha Shinkawa. Active years: 1993-1994.
Company Filing History:
Years Active: 1993-1994
Title: Kanji Ozawa: Innovator in Bonding Technology
Introduction
Kanji Ozawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of bonding technology, holding a total of 4 patents. His innovative designs focus on enhancing the efficiency and effectiveness of bonding machines.
Latest Patents
One of his latest patents is the suction adhesion-type holder. This device is utilized in bonding machines that include an air cooling device. The cooling device is strategically placed between the bonding stage and a vacuum pump, which creates a vacuum suction in the bonding stage. The air suction holes formed in the bonding stage, equipped with a heating element, connect to the air cooling device via a pipe. The heated air flows through a spiral pipe installed inside the cooling device, where it is cooled by a fan before being sucked into the vacuum pump.
Another notable patent is the bonding machine with oxidation preventive means. This invention features an oxidation preventive assembly consisting of two pipes installed on the bonding stage. These pipes are designed with gas discharge holes, and their terminal ends are closed by a block to prevent back-flow of the supplied gas. This design creates a uniform gas atmosphere around the workpiece placed on the bonding stage, effectively preventing oxidation.
Career Highlights
Kanji Ozawa is currently employed at Kabushiki Kaisha Shinkawa, where he continues to develop innovative solutions in bonding technology. His work has significantly impacted the efficiency of bonding processes in various applications.
Collaborations
Throughout his career, Kanji has collaborated with notable coworkers, including Yukitaka Sonoda and Yukitaki Sonoda. Their combined expertise has contributed to the advancement of bonding technologies.
Conclusion
Kanji Ozawa is a distinguished inventor whose work in bonding technology has led to several innovative patents. His contributions continue to shape the industry, making significant strides in improving bonding processes.