Kang-Wei Ma

Title: Innovations of Kang-Wei Ma

Introduction

Kang-Wei Ma is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on improving the efficiency and reliability of semiconductor devices.

Latest Patents

Kang-Wei Ma's latest patents include a "Leadframe with die pad" and a "Packaging structure integrating passive devices." The leadframe patent describes a design that includes a die pad, tie bars, metal extrusions, and leads arranged around the die pad. This innovative design enhances ground connections through wire-bonding and secures the die pad without stress transmission. The second patent outlines a leadframe packaging structure that integrates passive devices, featuring a chip-bonding region and an encapsulant material that protects the components.

Career Highlights

Kang-Wei Ma is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the capabilities of semiconductor devices.

Collaborations

Kang-Wei Ma has collaborated with notable colleagues such as Sheng-Tsung Liu and Shu-Chen Yang. Their combined expertise contributes to the innovative projects at Advanced Semiconductor Engineering, Inc.

Conclusion

Kang-Wei Ma's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of reliable and efficient semiconductor technologies.