This inventor holds 1 USPTO granted patent. Top assignee: Lsi Logic Corporation. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Kang-rong Chiang and Rapid Wafer Bumping
Introduction
Kang-rong Chiang is an inventor associated with San Jose, California, and LSI Logic Corporation. His patent work addresses wafer bumping, a process used to form conductive connections on semiconductor wafers.
Latest Patents
Chiang is credited with 1 patent: “Method of Rapid Wafer Bumping.” The invention describes spreading electrically conductive paste over a surface containing multiple electrical contacts, then directing an energy beam at a beam-paste interaction volume. This bonds part of the paste layer to at least one contact, forming a wafer bump.
Career Highlights
Chiang’s listed patent reflects work on a method for forming wafer bumps through the localized application of energy. The patent identifies LSI Logic Corporation as the company associated with his work.
Collaborations
Chiang is listed as a coworker of Senol Pekin. The available information does not specify further details about their collaboration.
Conclusion
Kang-rong Chiang’s patent focuses on a rapid wafer-bumping method that bonds conductive paste to electrical contacts using an energy beam.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile