The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Aug. 11, 2000
Applicant:
Inventors:
Senol Pekin, San Jose, CA (US);
Kang-rong Chiang, San Jose, CA (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A method for wafer bumping includes the steps of spreading a layer of an electrically conductive paste on a surface having a plurality of electrical contacts and exposing a beam-paste interaction volume to a beam of energy to bond a portion of the layer of the electrically conductive paste to at least one of the plurality of electrical contacts for forming a wafer bump.