This inventor holds 2 USPTO granted patents. Top assignee: Shin-Etsu Handotai Co., Ltd.. Active years: 1997-1999.
Location History:
- Fukushima-ken, JP (1997)
- Nishishirakawa, JP (1999)
Company Filing History:
Years Active: 1997-1999
Title: Kaneyoshi Aramaki: Innovator in Semiconductor Manufacturing
Introduction
Kaneyoshi Aramaki is a prominent inventor based in Fukushima, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding 2 patents that showcase his innovative approaches. His work focuses on improving the efficiency and quality of semiconductor wafer production.
Latest Patents
One of Aramaki's latest patents is a method of manufacturing semiconductor wafers. This method includes a slicing process for cutting a semiconductor monocrystalline ingot to obtain a disc-shaped semiconductor wafer. The process involves etching the sliced wafer before it is transported to subsequent processes. This innovative approach prevents breakage, cracks, and chips, enabling the production of large-diameter wafers with high productivity and yield. Another notable patent is a wafer notch dimension measuring apparatus. This apparatus can concurrently measure the depth and angle of a notch in the peripheral edge of a wafer. It includes a unit for rotating the wafer, a wafer edge detector, and an arithmetical unit for computing the dimensions of the notch.
Career Highlights
Kaneyoshi Aramaki is associated with Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His work at this company has been instrumental in advancing semiconductor manufacturing techniques.
Collaborations
Aramaki has collaborated with notable coworkers such as Shigetoshi Shimoyama and Kohei Toyama. Their combined expertise has contributed to the development of innovative solutions in semiconductor technology.
Conclusion
Kaneyoshi Aramaki's contributions to semiconductor manufacturing through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor production.