Kandaswamy Prabakaran

Title: Kandaswamy Prabakaran: Innovator in Semiconductor Technology

Introduction

Kandaswamy Prabakaran is a notable inventor based in Orefield, PA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on systems and methods that enhance the functionality of multi-mode semiconductor devices.

Latest Patents

Prabakaran's latest patents include "Systems and methods for supporting a subset of multiple interface types in a semiconductor device." This patent discusses various systems and methods for implementing multi-mode semiconductor devices. For instance, it describes a multi-mode semiconductor device that features a device package with several package pins. The device also includes a semiconductor die or substrate equipped with at least two IO buffers. One IO buffer is positioned at a distance from a package pin, while another is located at a different distance. One of the IO buffers contains a first bond pad that is electrically coupled to a circuit implementing a first interface type, along with a floating bond pad. The other IO buffer includes a second bond pad that is electrically connected to a circuit implementing a second interface type. In some instances, the floating bond pad is electrically linked to the circuit implementing the second interface type through a conductive interconnect, and it is also connected to the package pin.

Another of his patents is titled "Systems and methods for distributing I/O in a semiconductor device." Similar to his previous work, this patent discusses various systems and methods for multi-mode semiconductor devices. It describes a device package with multiple package pins and a semiconductor die that has at least two IO buffers. One IO buffer is located closer to a specific package pin, while the other is positioned further away. The closest IO buffer includes a first bond pad that is electrically coupled to a circuit implementing a first interface type and a first floating bond pad. The other IO buffer contains a second bond pad that is electrically connected to a circuit implementing a second interface type and a second floating bond pad. In some cases, the first floating bond pad is electrically linked to the circuit implementing the second interface type via a metal layer wire, and it is also connected to the specific package pin.

Career Highlights

Kandaswamy Prabakaran is currently employed at Agere Systems Inc., where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more