The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Mar. 12, 2007
Parag Madhani, Allentown, PA (US);
Paul F. Barnes, Coplay, PA (US);
Donald E. Hawk, Jr., King of Prussia, PA (US);
Kandaswamy Prabakaran, Orefield, PA (US);
Parag Madhani, Allentown, PA (US);
Paul F. Barnes, Coplay, PA (US);
Donald E. Hawk, Jr., King of Prussia, PA (US);
Kandaswamy Prabakaran, Orefield, PA (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a number of package pins. In addition, the device includes a semiconductor die or substrate with at least two IO buffers. One of the IO buffers is located a distance from a package pin and another of the IO buffers is located another distance from the package pin. One of the IO buffers includes first bond pad electrically coupled to a circuit implementing a first interface type and a floating bond pad, and the other IO buffer includes a second bond pad electrically coupled to a circuit implementing a second interface type. In some cases, the floating bond pad is electrically coupled to the circuit implementing the second interface type via a conductive interconnect, and the floating bond pad is electrically coupled to the package pin.