Kan Wae Lam

Title: Kan Wae Lam: Semiconductor Packaging and Die Singulation

Introduction

Kan Wae Lam is an inventor associated with Nexperia B.V. in Nijmegen, the Netherlands. His patent work concerns semiconductor manufacturing, particularly the singulation of individual dies from a wafer.

Latest Patents

The provided information identifies one patent associated with Lam: “Method of Singulation of Dies from a Wafer.” The invention describes a process for separating dies from a wafer that has a semiconductor layer and a backside coating containing at least one metallization layer.

The method first dices the wafer from its topside along saw streets in multiple directions, using plasma dicing to a depth corresponding to the interface between the semiconductor layer and the coating. It then uses an etch mask aligned with the saw streets to etch the remaining metallization layers and complete the separation of the dies. The approach addresses singulation when backside metallization is present. Lam is credited with 1 patent in the information provided.

Career Highlights

Lam’s listed work connects him with Nexperia B.V., a semiconductor company. His patent focuses on a manufacturing step that can help separate semiconductor dies while accounting for both the wafer material and its backside coating.

Collaborations

The provided information lists Randolph Estal Flauta and Wai Hung William Hor as Lam’s coworkers. Their specific roles in the patent or related work are not specified.

Conclusion

Kan Wae Lam’s listed patent addresses wafer singulation through a combination of plasma dicing and etching, with particular attention to wafers that include backside metallization.