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For the Inventor, By the Inventor

Hopewell Junction, NY, United States of America

Kamalesh S Desai

This inventor holds 10 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1982-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kamalesh S Desai. Retrieved from https://idiyas.com/inventor/kamalesh-s-desai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 90.0

Average Co-Inventor Count = 2.9

ph-index = 5

Forward Citations = 121(Granted Patents)


Location History:

  • Wappingers Falls, NY (US) (1982 - 1989)
  • Hopewell Junction, NY (US) (1995 - 2002)

Company Filing History:

goldMedal10 out of 166,409 
 
International Business Machines Corporation
 patents

Years Active: 1982-2002

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10 patents (USPTO):Explore Patents
1. 6455331 - Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices (2002-09-24),
2. 6340626 - Method for making a metallic pattern by photolithography (2002-01-22),
3. 6248599 - Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices (2001-06-19),
4. 6048741 - Top-surface-metallurgy plate-up bonding and rewiring for multilayer (2000-04-11),
5. 5448650 - Thin-film latent open optical detection with template-based feature (1995-09-05),
6. 5446246 - MLC conductor pattern off-set design to eliminate line to via cracking (1995-08-29),
7. 4808435 - Screen printing method for producing lines of uniform width and height (1989-02-28),
8. 4799983 - Multilayer ceramic substrate and process for forming therefor (1989-01-24),
9. 4407007 - Process and structure for minimizing delamination in the fabrication of (1983-09-27),
10. 4347735 - Process for monitoring solvent content of green ceramic sheet, and (1982-09-07),

Title: Innovations of Kamalesh S Desai

Introduction

Kamalesh S Desai is a notable inventor based in Hopewell Junction, NY (US). He has made significant contributions to the field of technology, particularly in device repair processes and photolithography methods. With a total of 10 patents to his name, Desai's work has had a substantial impact on the industry.

Latest Patents

One of his latest patents is titled "Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices." This innovative device repair process involves removing a passivation polyimide layer using a two-step ash process, followed by cleaning with sodium hydroxide (NaOH). After the removal of the passivation layer, a seed layer is deposited, and a photoresist is formed to create bond sites for repair metallurgy plating. The process ensures that the device is effectively repaired while maintaining its functionality.

Another significant patent is the "Method for making a metallic pattern by photolithography." This method utilizes redundant photolithography to minimize defects in the metal layer that defines the desired metallic pattern. By addressing the issue of contaminants in the photoresist layer, Desai's method enhances the quality and reliability of the metallic patterns produced.

Career Highlights

Kamalesh S Desai is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and contribute to advancements in technology. His expertise in device repair and photolithography has positioned him as a valuable asset in his field.

Collaborations

Desai has collaborated with notable coworkers, including Roy Rongqing Yu and Peter A Franklin. These collaborations have further enriched his work and contributed to the development of innovative solutions in technology.

Conclusion

Kamalesh S Desai's contributions to the field of technology through his patents and innovative methods have made a lasting impact. His work continues to influence advancements in device repair and photolithography, showcasing his dedication to innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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