The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Dec. 02, 1999
Roy Yu, Poughkeepsie, NY (US);
Kamalesh S. Desai, Hopewell Junction, NY (US);
Peter A. Franklin, Marlboro, NY (US);
Suryanarayana Kaja, Hopewell Junction, NY (US);
Kimberley A. Kelly, Poughkeepsie, NY (US);
Yeeling L. Lee, Amawalk, NY (US);
Arthur G. Merryman, Hopewell Junction, NY (US);
Frank R. Morelli, Marlboro, NY (US);
Thomas A. Wassick, Lagrangeville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A device repair process that includes removing a passivation polyimide layer. The passivation polyimide layer is removed using a first-half ash followed by a second-half ash. The device is then cleaned using sodium hydroxide (NaOH) and a subsequent light ash step is implemented. After the passivation polyimide layer is removed, a seed layer is deposited on the device. A photoresist is formed on the seed layer and bond sites are formed in the photoresist. Repair metallurgy is plated through the bond sites. The bond sites are plated by coupling the device to a fixture and applying the current for plating to the fixture. The contact between the device and the fixture is made though bottom surface metallurgy. After plating, the residual seed layer is removed and a laser delete process is implemented to disconnect and isolate the nets of the device.