Frank R Morelli

Title: Frank R. Morelli: Innovator in Device Repair Technologies

Introduction

Frank R. Morelli is a notable inventor based in Marlboro, NY (US). He has made significant contributions to the field of device repair technologies, holding a total of 3 patents. His work primarily focuses on advanced processes that enhance the reliability and efficiency of multilayer devices.

Latest Patents

One of Frank R. Morelli's latest patents is titled "Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices." This innovative device repair process involves the removal of a passivation polyimide layer through a two-step ash process. The device is rotated during the second-half ash to ensure thorough cleaning. Following this, sodium hydroxide (NaOH) is used for cleaning, and a light ash step is implemented. After the passivation layer is removed, a seed layer is deposited, and a photoresist is formed on it. Bond sites are created in the photoresist, allowing for repair metallurgy to be plated through these sites. The bonding process involves coupling the device to a fixture and applying current for plating, with contact made through bottom surface metallurgy. After plating, the residual seed layer is removed, and a laser delete process is executed to disconnect and isolate the nets of the device.

Career Highlights

Frank R. Morelli is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His expertise in device repair processes has positioned him as a key contributor to advancements in the field.

Collaborations

Frank has collaborated with notable coworkers such as Roy Rongqing Yu and Kamalesh S. Desai, further enhancing the innovative environment at IBM.

Conclusion

Frank R. Morelli's contributions to device repair technologies exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of complex processes that improve device functionality and reliability.