Wappingers Falls, NY, United States of America

Kamalesh K Srivistava

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kamalesh K Srivistava. Retrieved from https://idiyas.com/inventor/kamalesh-k-srivistava

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Innovations of Kamalesh K Srivistava

Introduction

Kamalesh K Srivistava is a notable inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of integrated circuits, particularly through his innovative patent related to lead-free solder joints.

Latest Patents

Kamalesh holds a patent for the "Creation of lead-free solder joint with intermetallics." This method involves coupling an integrated circuit to a substrate by providing the substrate, forming a contact pad, and contacting the pad with a solder ball. The process includes repeatedly exposing the solder ball to thermal conditions to facilitate the formation of intermetallics based on the metal in the contact pad. He has 1 patent to his name.

Career Highlights

Kamalesh is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop innovative solutions in the technology sector.

Collaborations

Some of his notable coworkers include Charles Leon Arvin and Valerie A Oberson. Their collaboration has contributed to the advancement of technology and innovation within their projects.

Conclusion

Kamalesh K Srivistava's contributions to the field of integrated circuits and his innovative patent demonstrate his commitment to advancing technology. His work continues to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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