The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Sep. 30, 2010
Charles L. Arvin, Poughkeepsie, NY (US);
Valerie Oberson, Quebec, CA;
Srinivasa N. Reddy, LeGrangeville, NY (US);
Krystyna W. Semkow, Poughquag, NY (US);
Richard A. Shelleman, Poughkeepsie, NY (US);
Kamalesh K. Srivistava, Wappinger Falls, NY (US);
Charles L. Arvin, Poughkeepsie, NY (US);
Valerie Oberson, Quebec, CA;
Srinivasa N. Reddy, LeGrangeville, NY (US);
Krystyna W. Semkow, Poughquag, NY (US);
Richard A. Shelleman, Poughkeepsie, NY (US);
Kamalesh K. Srivistava, Wappinger Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of coupling an integrated circuit to a substrate includes providing the substrate, forming a contact pad in the substrate, contacting the contact pad with a solder ball, and repeatedly exposing the solder ball to a thermal process to cause intermetallics based on a metal in the contact pad to be formed in the thermal ball.