Shanghai, China

Kaikai Liu

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kaikai Liu. Retrieved from https://idiyas.com/inventor/kaikai-liu-xrn0js47

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Kaikai Liu - Innovator in Heat Dissipation Technology

Introduction

Kaikai Liu is a prominent inventor based in Shanghai, China. He is known for his innovative contributions to the field of heat dissipation technology. Liu's work has significant implications for the efficiency and performance of communication devices.

Latest Patents

Liu holds a patent for a "Heat dissipation assembly and communications device." This invention includes a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe. The design features a window in the cage's side face, allowing the cold side of the TEC assembly to thermally communicate with the heat-emitting device inside the cage. The mounting kit enables the TEC assembly to move closer to or further away from the heat-emitting device, enhancing thermal management.

Career Highlights

Kaikai Liu is currently employed at Huawei Technologies Co., Limited, where he continues to develop cutting-edge technologies. His work at Huawei has positioned him as a key player in the advancement of communication devices.

Collaborations

Liu collaborates with talented coworkers, including Xingxing Huang and Shineng Chen, who contribute to his innovative projects.

Conclusion

Kaikai Liu's contributions to heat dissipation technology exemplify the importance of innovation in enhancing communication devices. His patent and ongoing work at Huawei reflect his commitment to advancing technology in this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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