The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Nov. 18, 2016
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Xingxing Huang, Shenzhen, CN;

Kaikai Liu, Shanghai, CN;

Shineng Chen, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F25B 21/02 (2006.01); G02B 6/42 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20263 (2013.01); F25B 21/02 (2013.01); G02B 6/42 (2013.01); G02B 6/4266 (2013.01); G02B 6/4268 (2013.01); G02B 6/4271 (2013.01); H05K 5/0026 (2013.01); H05K 7/2049 (2013.01); H05K 7/20281 (2013.01); H05K 7/20336 (2013.01); H05K 7/20445 (2013.01); F25B 2321/023 (2013.01); F25B 2321/0251 (2013.01); F25B 2321/0252 (2013.01);
Abstract

Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe, where a window is provided in a side face of the cage, the TEC assembly is located on an outer side of the cage, and a cold side of the TEC assembly passes through the window and thermally communicates with the heat emitting device in the cage; the mounting kit is configured to mount the TEC assembly and enable the TEC assembly to move in a direction leaving or approaching the heat emitting device; and a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly.


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