This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Inventor Kai-yun Lin
Introduction
Kai-yun Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative work has led to the development of a unique package structure that enhances the functionality and efficiency of electronic devices.
Latest Patents
Kai-yun Lin holds a patent for a "Package structure and method for forming the same." This patent describes a package structure that includes a die, a first molding surrounding the die, a first redistribution layer (RDL), and an interposer disposed over the first RDL. The structure is designed to improve electrical connections and overall performance in semiconductor applications. The patent details the components, including a first dielectric layer and interconnect structures, which are crucial for the effective operation of the package.
Career Highlights
Kai-yun Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves research and development, focusing on innovative packaging solutions that meet the demands of modern electronics. His expertise in this area has positioned him as a valuable asset to his company.
Conclusion
Kai-yun Lin's contributions to semiconductor packaging through his patent demonstrate his innovative spirit and technical expertise. His work continues to influence the industry, paving the way for advancements in electronic device performance.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile